Frore Systems Unveils LiquidJet: Next-Generation Liquid Cooling for AI Data Centers

Frore Systems has introduced LiquidJet, a groundbreaking direct-to-chip liquid cooling solution featuring a 3D coldplate architecture. Designed to address the rapidly increasing thermal demands of AI data centers, LiquidJet leverages Frore’s proprietary semiconductor manufacturing techniques, adapted for metal wafers, to deliver exceptional cooling performance for the world’s most advanced GPUs—beginning with the NVIDIA Blackwell Ultra series.

Revolutionary 3D Coldplate Architecture

At the core of LiquidJet is a unique 3D architecture that incorporates customized short-loop jet channel microstructures. This innovation sets a new standard for coldplate thermal efficiency, enabling data centers to extract higher performance from high-power GPUs while reducing operational costs. According to Frore Systems CEO and Founder Seshu Madhavapeddy, LiquidJet represents a transformative leap for coldplate technology, much like the company’s AirJet did for active cooling in consumer and edge devices.

Optimized for Current and Future AI Hardware

LiquidJet is already demonstrating impressive results with NVIDIA’s 1,400 W Blackwell Ultra GPUs, surpassing traditional coldplates across key cooling metrics:

  • Twice the hotspot power density (600 W/cm² at 40°C inlet temperature)
  • 50% higher kilowatts per liter per minute (KW/lpm)
  • Four times lower pressure drop

Engineered for scalability, LiquidJet is ready to support next-generation system-on-chips (SoCs) such as NVIDIA Rubin, Rubin Ultra, and Feynman—handling power requirements exceeding 4,000 W—as well as custom ASICs developed by hyperscale data center operators. This future-proof design ensures that as AI workloads continue to grow, LiquidJet’s architecture will keep pace with evolving hardware demands.

Innovative Manufacturing for Custom Cooling

Traditional coldplates are limited by legacy 2D microchannel manufacturing methods, which struggle to accommodate the complex and non-uniform power densities of modern chips. Frore Systems addresses this challenge by adapting advanced semiconductor manufacturing processes to metal wafers, enabling the creation of 3D short-loop jet channel microstructures tailored to the precise power map of each GPU or SoC.

This approach offers several key advantages:

  • Highly customized designs that match any SoC power distribution
  • Scalable and cost-effective manufacturing
  • Simple drop-in upgrades for existing systems
  • Significantly improved cooling performance

The result is a coldplate solution that evolves in step with the rapid advancements in AI hardware, ensuring optimal thermal management for the most demanding data center environments.

Benefits for AI Data Centers

  • Lower GPU operating temperatures
  • Increased AI processing throughput (more tokens per second)
  • Reduced total cost of ownership (TCO)
  • Improved power usage effectiveness (PUE)

Frore Systems’ LiquidJet sets a new benchmark for liquid cooling in AI data centers, delivering the performance, scalability, and efficiency required to support the next generation of artificial intelligence workloads.