Longsys Unveils Industry-First Integrated-Packaging Micro SSD
Longsys has introduced a groundbreaking micro SSD (mSSD) that sets a new standard in solid-state drive design and manufacturing. This innovative mSSD is the first in the industry to feature a fully integrated, chip-level System-in-Package (SiP) architecture, eliminating the need for traditional printed circuit board (PCB) assembly.
Advanced Wafer-Level SiP Technology
The new mSSD leverages wafer-level SiP technology to combine the controller, NAND flash memory, power management integrated circuit (PMIC), and passive components into a single, compact package. By removing nearly 1,000 solder joints typically found in conventional PCB-based SSDs, Longsys has significantly enhanced product reliability. The company reports a reduction in defect rates from ≤1000 DPPM (defective parts per million) to ≤100 DPPM, marking a substantial improvement in quality assurance.
This integrated approach also streamlines the manufacturing process by eliminating multiple surface-mount technology (SMT) and reflow steps. As a result, production efficiency is increased, manufacturing costs are reduced by over 10%, and both energy consumption and carbon emissions are lowered, supporting more sustainable electronics manufacturing.
High Performance in a Compact Form Factor
Despite its ultra-compact dimensions of 20 × 30 × 2.0 mm and a lightweight 2.2 grams, the Longsys mSSD delivers full PCIe Gen 4 ×4 performance. Users can expect sequential read speeds of up to 7,400 MB/s and write speeds up to 6,500 MB/s, along with impressive 4K random performance of up to 1,000,000 IOPS for reads and 820,000 IOPS for writes.
Thermal management is addressed through an aluminum frame, a graphene thermal pad, and thermal silicone, ensuring efficient heat dissipation even under demanding workloads. The mSSD supports both TLC and QLC NAND configurations, with storage capacities ranging from 512 GB to 4 TB.
Flexible Design and Patent Protection
To accommodate various device requirements, the mSSD features a modular, clip-on heatsink that enables easy conversion between M.2 2230, 2242, and 2280 form factors. This flexibility makes it suitable for a wide range of applications, from ultrabooks to high-performance desktops.
Longsys has begun mass production of the new mSSD and has filed for international patents to protect its innovative design and manufacturing process. This advancement marks a significant step forward in SSD technology, offering enhanced reliability, efficiency, and performance in a remarkably small package.
